|
 |
|
 As Cut and As Lapped Wafers
Non polished silicon wafers are used for a variety of discrete and solar cell applications.
The typical process flow for polished silicon wafers is Slicing — Lapping or Grinding — Etching — Polishing.
SEH can supply wafers as sliced ( as cut ), as lapped, and as etched. The choice will depend on the degree of surface topography and surface damage which may be tolerated by your process.
|
Minimum
Thickness
[µm]
|
4
|
300
|
250
|
200
|
200
|
180
|
|
5
|
400
|
300
|
240
|
240
|
210
|
|
6
|
500
|
500
|
300
|
450
|
300
|
|
Maximum
Thickness
[µm]
|
4
|
1200
|
1200
|
1200
|
|
5
|
1200
|
1200
|
1200
|
|
6
|
1200
|
1200
|
1200
|
|
Tolerance
[µm]
|
4
|
± 15
|
± 7
|
± 5
|
± 7
|
|
5
|
± 15
|
± 7
|
± 5
|
± 7
|
|
6
|
± 15
|
± 7
|
± 5
|
± 7
|
|
Thickness
Variation
[µm]
|
4
|
<=15
|
<=2.0
|
<=6.0
|
|
5
|
<=15
|
<=2.0
|
<=6.0
|
|
6
|
<=15
|
<=2.0
|
<=6.0
|
|
|
