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Mechanical Wafers
Useful for machine setup, wafer-handling tests, etc. requiring mechanical integrity
and clean surface conditions. Not recommended for thermal applications requiring
device quality bulk or surface defect characteristics.
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Dia |
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5 |
6 |
8 |
12 |
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Product Code |
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5M |
6M |
8M |
12M |
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Type |
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Orient |
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Res |
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Surface Metals |
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Global Flatness |
TTV |
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| TIR |
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| FPD |
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Backside |
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Bow |
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Warp |
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Site Flatness (20X20) max site |
SBIR |
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| SBID |
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| SFLR |
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| SFLD |
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| SFQR |
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| SFQD |
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LPD USL |
< 0.12 |
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| <0.13 |
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| <0.16 |
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| <0.20 |
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| <0.30 |
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Epi Thickness |
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Epi Res |
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** |
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Epi Stacking Faults |
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Laser Mark |
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** Specifications subject to availability
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